An optimum spacing problem for four chips on a horizontal substrate - Mixed convection

Yang Liu; S. Chen; B. W. Shiu

doi:10.1007/PL00009638

An optimum spacing problem for four chips on a horizontal substrate - Mixed convection

Yang Liu
, S. Chen
, B. W. Shiu

Research output: Journal article publication › Journal article › Academic research › peer-review

6 Citations (Scopus)

Abstract

The optimum spacing problem for four heated chips rested on a conductive substrate in a channel is solved by an operator-splitting pseudo-time-stepping finite element method, which automatically satisfies the continuity of the interfacial temperature and heat flux. It is found that the conventional equi-spaced arrangement is not an optimum option for mixed convection situation. An optimum thermal performance can be obtained when the center-to-center distances between the chips follow a geometric series. When the ratio is larger than 1.2, the maximum temperature and the maximum temperature difference can be decreased significantly compared to the ratio of 1.0.

Original language	English
Pages (from-to)	470-477
Number of pages	8
Journal	Computational Mechanics
Volume	26
Issue number	5
DOIs	https://doi.org/10.1007/PL00009638
Publication status	Published - 1 Jan 2000

ASJC Scopus subject areas

Ocean Engineering
Mechanical Engineering
Computational Theory and Mathematics
Computational Mathematics
Applied Mathematics

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10.1007/PL00009638

Cite this

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An optimum spacing problem for four chips on a horizontal substrate - Mixed convection

Abstract

ASJC Scopus subject areas

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