An optimum spacing problem for four chips on a horizontal substrate - Mixed convection

Yang Liu, S. Chen, B. W. Shiu

Research output: Journal article publicationJournal articleAcademic researchpeer-review

5 Citations (Scopus)

Abstract

The optimum spacing problem for four heated chips rested on a conductive substrate in a channel is solved by an operator-splitting pseudo-time-stepping finite element method, which automatically satisfies the continuity of the interfacial temperature and heat flux. It is found that the conventional equi-spaced arrangement is not an optimum option for mixed convection situation. An optimum thermal performance can be obtained when the center-to-center distances between the chips follow a geometric series. When the ratio is larger than 1.2, the maximum temperature and the maximum temperature difference can be decreased significantly compared to the ratio of 1.0.
Original languageEnglish
Pages (from-to)470-477
Number of pages8
JournalComputational Mechanics
Volume26
Issue number5
DOIs
Publication statusPublished - 1 Jan 2000

ASJC Scopus subject areas

  • Ocean Engineering
  • Mechanical Engineering
  • Computational Theory and Mathematics
  • Computational Mathematics
  • Applied Mathematics

Cite this