Abstract
The optimum spacing problem for five heated chips rested on a conductive substrate in a two dimensional enclosure filled with air is solved by an operator-splitting pseudo-time-stepping finite element method, which automatically satisfies the continuity of the interfacial temperature and heat flux. It is found that the conventional equi-spaced arrangement is not an optimum option. An optimum thermal performance can be obtained when the center-to-center distances between the chips follow a geometric series. The maximum relative temperature drop in the optimum configuration can be as much as 17% of the equi-spaced arrangement.
Original language | English |
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Pages (from-to) | 167-186 |
Number of pages | 20 |
Journal | International Journal of Computational Engineering Science |
Volume | 1 |
Issue number | 1 |
DOIs | |
Publication status | Published - 2000 |
ASJC Scopus subject areas
- Computational Theory and Mathematics
- Computational Mathematics