An optimum spacing problem for five chips on a horizontal substrate in an enclosure - natural convection

Yang Liu, Chun Wah Leung, Tat Leung Chan, N. Phan-Thien

Research output: Journal article publicationJournal articleAcademic researchpeer-review

Abstract

The optimum spacing problem for five heated chips rested on a conductive substrate in a two dimensional enclosure filled with air is solved by an operator-splitting pseudo-time-stepping finite element method, which automatically satisfies the continuity of the interfacial temperature and heat flux. It is found that the conventional equi-spaced arrangement is not an optimum option. An optimum thermal performance can be obtained when the center-to-center distances between the chips follow a geometric series. The maximum relative temperature drop in the optimum configuration can be as much as 17% of the equi-spaced arrangement.
Original languageEnglish
Pages (from-to)167-186
Number of pages20
JournalInternational Journal of Computational Engineering Science
Volume1
Issue number1
DOIs
Publication statusPublished - 2000

ASJC Scopus subject areas

  • Computational Theory and Mathematics
  • Computational Mathematics

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