An Online Gate Oxide Degradation Monitoring Method for SiC MOSFETs Based on Turn-ON Gate Current Change Rate

Research output: Journal article publicationJournal articleAcademic researchpeer-review

Abstract

Gate oxide degradation (GOD) presents a reliability issue for silicon carbide (SiC) metal-oxide-semiconductor fieldeffect transistors (MOSFETs), especially under high-temperature and high-electric-field conditions. This letter proposes an online condition monitoring (CM) method based on the peak value of the turn-on gate current change rate (dig/dt,max). The technique utilizes a non-invasive PCB Rogowski coil to measure dig/dt,max, demonstrating high practicality. Accelerated aging tests under positive and negative high-temperature gate bias (HTGB) and hightemperature gate switching (HTGS) conditions reveal correlations between dig/dt,max and GOD, with variations of 5.61%, 5% and 8.33%, after 160 hours of aging. Double pulse test (DPT) results indicate that dig/dt,max is independent of external factors such as temperature, drain-source voltage (Vds), drain current (Ids) and package aging. Results from a buck converter further validate the feasibility of long-term online monitoring.

Original languageEnglish
Pages (from-to)1-5
Number of pages5
JournalIEEE Transactions on Power Electronics
DOIs
Publication statusAccepted/In press - May 2025

Keywords

  • condition monitoring
  • gate current
  • gate oxide
  • PCB Rogowski coil
  • SiC MOSFET

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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