TY - GEN
T1 - An on-chip opto-mechanical accelerometer
AU - Dong, B.
AU - Cai, H.
AU - Tsai, J. M.
AU - Kwong, D. L.
AU - Liu, A. Q.
PY - 2013/1
Y1 - 2013/1
N2 - Optically enabled accelerometers offer superior displacement resolution and resilience to electromagnetic interference, which brought benefits to a wide range of applications ranging from inertial navigation to consumer electronics [1, 2]. However, impossible chip scale integration hampered their practical applications [2]. In this paper, a novel in-plane opto-mechanical accelerometer is demonstrated, which employs Whisper Gallery Mode (WGM) ring resonator (RR) as a displacement sensor that monolithically integrated with a nano-tethered proof mass with high mechanical Q-factor. Utilizing design optimized for strong opto-mechanical interactions allows the detection with high sensitivity of 3.279 pm/g at low-power operation.
AB - Optically enabled accelerometers offer superior displacement resolution and resilience to electromagnetic interference, which brought benefits to a wide range of applications ranging from inertial navigation to consumer electronics [1, 2]. However, impossible chip scale integration hampered their practical applications [2]. In this paper, a novel in-plane opto-mechanical accelerometer is demonstrated, which employs Whisper Gallery Mode (WGM) ring resonator (RR) as a displacement sensor that monolithically integrated with a nano-tethered proof mass with high mechanical Q-factor. Utilizing design optimized for strong opto-mechanical interactions allows the detection with high sensitivity of 3.279 pm/g at low-power operation.
UR - http://www.scopus.com/inward/record.url?scp=84875448610&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2013.6474323
DO - 10.1109/MEMSYS.2013.6474323
M3 - Conference article published in proceeding or book
AN - SCOPUS:84875448610
SN - 9781467356558
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 641
EP - 644
BT - IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
T2 - IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Y2 - 20 January 2013 through 24 January 2013
ER -