An Investigation of factors affecting and optimizing material removal rate in computer controlled ultra-precision polishing

Lai Ting Ho, Chi Fai Cheung, Liam Blunt, Shengyue Zeng

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

1 Citation (Scopus)

Abstract

There are numerous parameters and steps involved in a computer controlled ultra-precision polishing process (CCUP). The success of CCUP relies heavily on the understanding and optimization of material removal when new materials and new surfaces are polished. It is crucial to optimize the polishing parameters to enhance the effectiveness of the polishing process and to assess the impact of different process parameters on the material removal rate of particular difficult-to-machine materials such as CoCr alloys, which is commonly used in orthopedic implants. This paper aims at studying the process parameters and optimization of the parameter to enhance the material removal rate and quantify the contribution of process parameters.
Original languageEnglish
Title of host publicationPrecision Engineering and Nanotechnology V
PublisherTrans Tech Publications Ltd
Pages446-452
Number of pages7
ISBN (Print)9783038352112
DOIs
Publication statusPublished - 1 Jan 2015
Event5th International Conference on Asian Society for Precision Engineering and Nanotechnology, ASPEN 2013 - Taipei, Taiwan
Duration: 12 Nov 201315 Nov 2013

Publication series

NameKey Engineering Materials
Volume625
ISSN (Print)1013-9826

Conference

Conference5th International Conference on Asian Society for Precision Engineering and Nanotechnology, ASPEN 2013
Country/TerritoryTaiwan
CityTaipei
Period12/11/1315/11/13

Keywords

  • ANOVA
  • Computer controlled Polishing
  • Mechanical polishing
  • Process optimization
  • Taguchi Method
  • Ultra-precision machining

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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