An intelligent approach for improving Printed Circuit Board Assembly Process Performance in Smart Manufacturing

Wah Cheong Vincent FUNG, Kam Chuen Yung

Research output: Journal article publicationJournal articleAcademic researchpeer-review

13 Citations (Scopus)

Fingerprint

Dive into the research topics of 'An intelligent approach for improving Printed Circuit Board Assembly Process Performance in Smart Manufacturing'. Together they form a unique fingerprint.

Keyphrases

Engineering