Skip to main navigation Skip to search Skip to main content

An empirical model for thermal interface materials based on experimental characterizations under realistic conditions

  • Yi Zhang
  • , H. Wang
  • , Z. Wang
  • , F. Blaabjerg

Research output: Journal article publicationJournal articleAcademic researchpeer-review

Abstract

Thermal interface materials (TIMs) contribute to a considerable part of thermal resistance from junction to ambient in power modules, which is an important design variable affecting the thermal loading and reliability performance. Nevertheless, the existing standard characterization methods for TIMs may not represent the realistic conditions in power module applications. Physical thermal models for TIMs are of high complexity, which is not always convenient enough to apply in engineering design. This paper proposes an empirical model for TIMs based on physical understandings and experimental characterizations under more realistic conditions. The proposed model includes two variables only, the initial thickness and screw torque. It retains the advantages in terms of accuracy and convenience in use. A realistic power electronic converter based experimental platform has been built and comprehensive experimental results have been conducted on a 1200 V/50 A IGBT module.

Original languageEnglish
Pages (from-to)806-811
Number of pages6
JournalMicroelectronics Reliability
Volume88-90
DOIs
Publication statusPublished - Sept 2018

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'An empirical model for thermal interface materials based on experimental characterizations under realistic conditions'. Together they form a unique fingerprint.

Cite this