An approach of lateral RF MEMS switch for high performance

M. Tang, A. Agarwal, J. Li, Q. X. Zhang, P. Win, J. M. Huang, A. Q. Liu

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

9 Citations (Scopus)

Abstract

This paper presents a novel type of lateral series microwave switch on a silicon-on-insulator (SOI) substrate with a coplanar waveguide (CPW) configuration. It is built with a cantilever beam at the side of the gap of the microwave t-line and laterally driven by electrostatic force. The mechanical structures are made of single-crystal-silicon and fabricated by deep reactive ion etch (DRIE) technology. Evaporated aluminum serves as contact material. The fabrication process only needs one mask. The measured result shows up to 26.5 GHz the isolation of the switch is over 18 dB. The threshold voltage is about 12 volts.

Original languageEnglish
Title of host publicationDTIP 2003 - Design, Test, Integration and Packaging of MEMS/MOEMS 2003
EditorsBernard Courtois, Jean Michel Karam, Jan Korvink, Karen Markus, Keren Bergman, Bernd Michel
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages99-102
Number of pages4
ISBN (Electronic)078037066X, 9780780370661
DOIs
Publication statusPublished - May 2003
Externally publishedYes
Event5th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003, DTIP 2003 - Cannes, France
Duration: 5 May 20037 May 2003

Publication series

NameDTIP 2003 - Design, Test, Integration and Packaging of MEMS/MOEMS 2003

Conference

Conference5th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003, DTIP 2003
Country/TerritoryFrance
CityCannes
Period5/05/037/05/03

Keywords

  • Aluminum
  • Contacts
  • Coplanar waveguides
  • Electrostatics
  • Etching
  • Isolation technology
  • Radiofrequency microelectromechanical systems
  • Silicon on insulator technology
  • Structural beams
  • Switches

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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