An alternative process for electroless copper plating on polyester fabric

R. H. Guo, S. Q. Jiang, C. W.M. Yuen, Man Ching Frankie Ng

Research output: Journal article publicationJournal articleAcademic researchpeer-review

79 Citations (Scopus)

Abstract

Electroless copper plating of polyester fabrics was demonstrated in the present investigation. The electroless Cu plating process on polyester fabric was modified by replacing the conventional PdCl2activator with an AgNO3activator to reduce the overall cost of the plating process. Both uncoated and Cu-coated polyester fabrics were characterized by the scanning electron microscope (SEM), energy dispersive spectroscopy (EDX), X-ray diffraction analysis (XRD) and X-ray photoelectron spectroscope (XPS). Relatively uniform and continuous plating was obtained under the given plating conditions. The possible mechanism of electroless copper plating of polyester fabrics utilizing an AgNO3activator was suggested. The electromagnetic interference (EMI) shielding effectiveness (SE) was also evaluated to study the shielding behavior of copper-plated polyester fabrics. The results demonstrated that copper-plated polyester fabrics can be applied for EMI shielding.
Original languageEnglish
Pages (from-to)33-38
Number of pages6
JournalJournal of Materials Science: Materials in Electronics
Volume20
Issue number1
DOIs
Publication statusPublished - 1 Jan 2009

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this