Aligning and soldering pure-copper nanowires for nanodevice fabrication

Bo Wang, Yan Xu, Kai Leung Yung, Wei Chen, Chun Lei Kang

Research output: Journal article publicationJournal articleAcademic researchpeer-review

3 Citations (Scopus)

Abstract

Pure-copper nanowires (NWs) were aligned and soldered without using N2as protection gas in the alignment and soldering processes. Unlike other research works that used segmented NWs for easier wetting and connection, this paper demonstrates soldering pure-copper NWs on microelectrodes using triethanolamine as soldering agent in the high-temperature soldering environment. The results of the electrical conductivity measurement show that the contact resistance between the microelectrodes bridged by NWs was remarkably reduced by the nanosoldering. Moreover, the resistance between two electrodes changed from 1.53 × 105to 136 ω. The methods introduced in this paper are anticipated to be useful to nanodevice fabrication.
Original languageEnglish
Article number6378383
Pages (from-to)519-526
Number of pages8
JournalJournal of Microelectromechanical Systems
Volume22
Issue number3
DOIs
Publication statusPublished - 1 Jan 2013

Keywords

  • Microelectrodes
  • microelectromechanical devices
  • microsensors
  • soldering

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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