AI-based Failure mechanism prediction system and method for PCB solder joints

Kin Man Lam; FUNG, Ka Chun; Lai, Cheung Ming; LIN, Kwan Ho; Ka Hong Loo; Kam Chuen Yung; Hang Shan Choy; XUE, Kaiwen; Saddam Aziz; NG Vincent To Yee

AI-based Failure mechanism prediction system and method for PCB solder joints

Kin Man Lam (Inventor)
, FUNG, Ka Chun (Inventor)
, Lai, Cheung Ming (Inventor)
, LIN, Kwan Ho (Inventor)
, Ka Hong Loo (Inventor)
, Kam Chuen Yung (Inventor)
, Hang Shan Choy (Inventor)
, XUE, Kaiwen (Inventor)
, Saddam Aziz (Inventor)
, NG Vincent To Yee (Inventor)

Research output: Patents, agreements, assignments and companies › Patents granted

Abstract

The present invention discloses a printed circuit board (PCB) soldering failure mechanism prediction system and method based on artificial intelligence (AI). The system (1000) comprises: a camera-based PCB soldering region detection module (1002) comprises a PCB defect classification model; a thermal imaging camera-based detection module (302) for PCB soldering failure mechanisms

Original language	English
Patent number	HK30094933
Filing date	8/11/23
Publication status	Published - 19 Jan 2024

Cite this

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title = "AI-based Failure mechanism prediction system and method for PCB solder joints",

abstract = "The present invention discloses a printed circuit board (PCB) soldering failure mechanism prediction system and method based on artificial intelligence (AI). The system (1000) comprises: a camera-based PCB soldering region detection module (1002) comprises a PCB defect classification model; a thermal imaging camera-based detection module (302) for PCB soldering failure mechanisms ",

author = "Lam, \{Kin Man\} and \{FUNG, Ka Chun\} and \{Lai, Cheung Ming\} and \{LIN, Kwan Ho\} and Loo, \{Ka Hong\} and Yung, \{Kam Chuen\} and Choy, \{Hang Shan\} and \{XUE, Kaiwen\} and Saddam Aziz and \{NG Vincent To Yee\}",

year = "2024",

month = jan,

day = "19",

language = "English",

type = "Patent",

note = "HK30094933",

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TY - PAT

T1 - AI-based Failure mechanism prediction system and method for PCB solder joints

AU - Lam, Kin Man

AU - FUNG, Ka Chun, null

AU - Lai, Cheung Ming, null

AU - LIN, Kwan Ho, null

AU - Loo, Ka Hong

AU - Yung, Kam Chuen

AU - Choy, Hang Shan

AU - XUE, Kaiwen,

AU - Aziz, Saddam

AU - NG Vincent To Yee,

PY - 2024/1/19

Y1 - 2024/1/19

N2 - The present invention discloses a printed circuit board (PCB) soldering failure mechanism prediction system and method based on artificial intelligence (AI). The system (1000) comprises: a camera-based PCB soldering region detection module (1002) comprises a PCB defect classification model; a thermal imaging camera-based detection module (302) for PCB soldering failure mechanisms

AB - The present invention discloses a printed circuit board (PCB) soldering failure mechanism prediction system and method based on artificial intelligence (AI). The system (1000) comprises: a camera-based PCB soldering region detection module (1002) comprises a PCB defect classification model; a thermal imaging camera-based detection module (302) for PCB soldering failure mechanisms

M3 - Patents granted

M1 - HK30094933

Y2 - 2023/11/08

ER -

AI-based Failure mechanism prediction system and method for PCB solder joints

Abstract

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