AI-based Failure mechanism prediction system and method for PCB solder joints

Kin Man Lam; FUNG, Ka Chun; Lai, Cheung Ming; LIN, Kwan Ho; Ka Hong Loo; Kam Chuen Yung; Hang Shan Choy; XUE, Kaiwen; Saddam Aziz; NG Vincent To Yee

AI-based Failure mechanism prediction system and method for PCB solder joints

Kin Man Lam (Inventor), FUNG, Ka Chun (Inventor), Lai, Cheung Ming (Inventor), LIN, Kwan Ho (Inventor), Ka Hong Loo (Inventor), Kam Chuen Yung (Inventor), Hang Shan Choy (Inventor), XUE, Kaiwen (Inventor), Saddam Aziz (Inventor), NG Vincent To Yee (Inventor)

Research output: Patents, agreements, assignments and companies › Patents granted

Abstract

The present invention discloses a printed circuit board (PCB) soldering failure mechanism prediction system and method based on artificial intelligence (AI). The system (1000) comprises: a camera-based PCB soldering region detection module (1002) comprises a PCB defect classification model; a thermal imaging camera-based detection module (302) for PCB soldering failure mechanisms

Original language	English
Patent number	HK30094933
Filing date	8/11/23
Publication status	Published - 19 Jan 2024

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title = "AI-based Failure mechanism prediction system and method for PCB solder joints",

abstract = "The present invention discloses a printed circuit board (PCB) soldering failure mechanism prediction system and method based on artificial intelligence (AI). The system (1000) comprises: a camera-based PCB soldering region detection module (1002) comprises a PCB defect classification model; a thermal imaging camera-based detection module (302) for PCB soldering failure mechanisms ",

author = "Lam, {Kin Man} and {FUNG, Ka Chun} and {Lai, Cheung Ming} and {LIN, Kwan Ho} and Loo, {Ka Hong} and Yung, {Kam Chuen} and Choy, {Hang Shan} and {XUE, Kaiwen} and Saddam Aziz and {NG Vincent To Yee}",

year = "2024",

month = jan,

day = "19",

language = "English",

type = "Patent",

note = "HK30094933",

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T1 - AI-based Failure mechanism prediction system and method for PCB solder joints

AU - Lam, Kin Man

AU - FUNG, Ka Chun, null

AU - Lai, Cheung Ming, null

AU - LIN, Kwan Ho, null

AU - Loo, Ka Hong

AU - Yung, Kam Chuen

AU - Choy, Hang Shan

AU - XUE, Kaiwen,

AU - Aziz, Saddam

AU - NG Vincent To Yee,

PY - 2024/1/19

Y1 - 2024/1/19

N2 - The present invention discloses a printed circuit board (PCB) soldering failure mechanism prediction system and method based on artificial intelligence (AI). The system (1000) comprises: a camera-based PCB soldering region detection module (1002) comprises a PCB defect classification model; a thermal imaging camera-based detection module (302) for PCB soldering failure mechanisms

AB - The present invention discloses a printed circuit board (PCB) soldering failure mechanism prediction system and method based on artificial intelligence (AI). The system (1000) comprises: a camera-based PCB soldering region detection module (1002) comprises a PCB defect classification model; a thermal imaging camera-based detection module (302) for PCB soldering failure mechanisms

M3 - Patents granted

M1 - HK30094933

Y2 - 2023/11/08

ER -

AI-based Failure mechanism prediction system and method for PCB solder joints

Abstract

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