AI-based Failure Mechanism Prediction for PCB Solder Joints

Kin Man Lam; Ka Chun Fung; Cheung Ming Lai; Hang Shan Choy; XUE, Kaiwen; Kwan Ho Lin; Ka Hong Loo; NG Vincent To Yee; Saddam Aziz; Kam Chuen Yung

AI-based Failure Mechanism Prediction for PCB Solder Joints

Kin Man Lam (Inventor)
, Ka Chun Fung (Inventor)
, Cheung Ming Lai (Inventor)
, Hang Shan Choy (Inventor)
, XUE, Kaiwen (Inventor)
, Kwan Ho Lin (Inventor)
, Ka Hong Loo (Inventor)
, NG Vincent To Yee (Inventor)
, Saddam Aziz (Inventor)
, Kam Chuen Yung (Inventor)

Research output: Patents, agreements, assignments and companies › Licensing agreements

Original language	English
Publication status	Published - 20 Sept 2024

Cite this

@misc{3a91d13608144fd98eab41df6d21953c,

title = "AI-based Failure Mechanism Prediction for PCB Solder Joints",

author = "Lam, \{Kin Man\} and Fung, \{Ka Chun\} and Lai, \{Cheung Ming\} and Choy, \{Hang Shan\} and \{XUE, Kaiwen\} and Lin, \{Kwan Ho\} and Loo, \{Ka Hong\} and \{NG Vincent To Yee\} and Saddam Aziz and Yung, \{Kam Chuen\}",

year = "2024",

month = sep,

day = "20",

language = "English",

type = "Patent",

}