Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test

Engineering

• Baseplate 33%
• Copper Substrate 33%
• Cycle Life 33%
• Delamination 33%
• Electrical Performance 33%
• Increasing Demand 33%
• Interconnects 100%
• Million Cycle 33%
• Power Electronics 33%
• Scanning Acoustic Microscopy 33%
• Test Environment 33%
• Thermal Performance 33%

Keyphrases

• Direct Bonded Copper 66%
• High-temperature Power Electronics 33%
• IGBT Power Module 33%
• Power Cycling Capability 33%