Abstract
Highlights Transfer printing techniques for the fabrication of flexible electronics are summarized. The versatility of transfer printing is promoted by adjusting substrate/device/stamp interfaces. Adjustments could be conducted on the donor/device interface, device/stamp and special stamp design. A comprehensive comparison of each adjustment regarding advantages, disadvantages and applications is conducted. Design guidelines and potential directions for future advancements in transfer printing are proposed.
| Original language | English |
|---|---|
| Article number | 052005 |
| Journal | International Journal of Extreme Manufacturing |
| Volume | 6 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - Oct 2024 |
Keywords
- adhesion
- flexible electronics
- interfacial adjujstments
- transfer printing
ASJC Scopus subject areas
- Industrial and Manufacturing Engineering
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