Advanced Design for High-Performance and AI Chips

Ying Cao; Yuejiao Chen; Xi Fan; Hong Fu; Bingang Xu

doi:10.1007/s40820-025-01850-w

Advanced Design for High-Performance and AI Chips

Ying Cao
, Yuejiao Chen
, Xi Fan
, Hong Fu
, Bingang Xu

Research output: Journal article publication › Review article › Academic research › peer-review

6 Citations (Scopus)

Abstract

A comprehensive review focused on the recent advancement of the advanced and artificial intelligence (AI) chip is presented. The design tactics for the enhanced and AI chips can be conducted from a diversity of aspects, with materials, circuit, architecture, and packaging technique taken into considerations, for the pursuit of multimodal data processing abilities, robust reconfigurability, high energy efficiency, and enhanced computing power. A broad outlook on the future considerations of the advanced chip is put forward.

Original language	English
Article number	13
Journal	Nano-Micro Letters
Volume	18
Issue number	1
DOIs	https://doi.org/10.1007/s40820-025-01850-w
Publication status	Published - Dec 2026

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 7 Affordable and Clean Energy

Keywords

Advanced chips
AI chips
Artificial intelligence
Design tactics
Review and perspective

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Surfaces, Coatings and Films
Electrical and Electronic Engineering

More information

10.1007/s40820-025-01850-w

http://hdl.handle.net/10397/116074

Cite this

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title = "Advanced Design for High-Performance and AI Chips",

abstract = "A comprehensive review focused on the recent advancement of the advanced and artificial intelligence (AI) chip is presented. The design tactics for the enhanced and AI chips can be conducted from a diversity of aspects, with materials, circuit, architecture, and packaging technique taken into considerations, for the pursuit of multimodal data processing abilities, robust reconfigurability, high energy efficiency, and enhanced computing power. A broad outlook on the future considerations of the advanced chip is put forward.",

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author = "Ying Cao and Yuejiao Chen and Xi Fan and Hong Fu and Bingang Xu",

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doi = "10.1007/s40820-025-01850-w",

language = "English",

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AU - Cao, Ying

AU - Chen, Yuejiao

AU - Fan, Xi

AU - Fu, Hong

AU - Xu, Bingang

N1 - Publisher Copyright: © The Author(s) 2025.

PY - 2026/12

Y1 - 2026/12

N2 - A comprehensive review focused on the recent advancement of the advanced and artificial intelligence (AI) chip is presented. The design tactics for the enhanced and AI chips can be conducted from a diversity of aspects, with materials, circuit, architecture, and packaging technique taken into considerations, for the pursuit of multimodal data processing abilities, robust reconfigurability, high energy efficiency, and enhanced computing power. A broad outlook on the future considerations of the advanced chip is put forward.

AB - A comprehensive review focused on the recent advancement of the advanced and artificial intelligence (AI) chip is presented. The design tactics for the enhanced and AI chips can be conducted from a diversity of aspects, with materials, circuit, architecture, and packaging technique taken into considerations, for the pursuit of multimodal data processing abilities, robust reconfigurability, high energy efficiency, and enhanced computing power. A broad outlook on the future considerations of the advanced chip is put forward.

KW - Advanced chips

KW - AI chips

KW - Artificial intelligence

KW - Design tactics

KW - Review and perspective

UR - https://www.scopus.com/pages/publications/105012163252

U2 - 10.1007/s40820-025-01850-w

DO - 10.1007/s40820-025-01850-w

M3 - Review article

AN - SCOPUS:105012163252

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VL - 18

JO - Nano-Micro Letters

JF - Nano-Micro Letters

IS - 1

M1 - 13

ER -

Advanced Design for High-Performance and AI Chips

Abstract

UN SDGs

Keywords

ASJC Scopus subject areas

More information

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