A tripartite partnership to elevate technology advancement of Hong Kong PCB and substrate industries

Kam Chuen Yung

A tripartite partnership to elevate technology advancement of Hong Kong PCB and substrate industries

Kam Chuen Yung

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research

Original language	English
Pages	6-7
Number of pages	2
Publication status	Published - 2001
Event	International Academic Conference on Electronic Packaging Research - Duration: 1 Jan 2001 → …

Conference

Conference	International Academic Conference on Electronic Packaging Research
Period	1/01/01 → …

Cite this

@conference{331a24e708a447f6b811bb62f0a9aa10,

title = "A tripartite partnership to elevate technology advancement of Hong Kong PCB and substrate industries",

author = "Yung, {Kam Chuen}",

year = "2001",

language = "English",

pages = "6--7",

note = "International Academic Conference on Electronic Packaging Research ; Conference date: 01-01-2001",

}

A tripartite partnership to elevate technology advancement of Hong Kong PCB and substrate industries. / Yung, Kam Chuen.
2001. 6-7 Paper presented at International Academic Conference on Electronic Packaging Research.

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research