A tripartite partnership to elevate technology advancement of Hong Kong PCB and substrate industries

Research output: Unpublished conference presentation (presented paper, abstract, poster)Conference presentation (not published in journal/proceeding/book)Academic research

Original languageEnglish
Pages6-7
Number of pages2
Publication statusPublished - 2001
EventInternational Academic Conference on Electronic Packaging Research -
Duration: 1 Jan 2001 → …

Conference

ConferenceInternational Academic Conference on Electronic Packaging Research
Period1/01/01 → …

Cite this