Abstract
Traditional tin-lead based solders used for packaging have recently met some serious challenges. These mainly include the increasing global concern on the environment and health, which requires to reduce or completely eliminate the use of toxic lead in most products, and the increased functionality and miniaturisation of modem optoelectronic and photonic components where the operational temperatures and stresses increase the demands of mechanical and electric properties on soldered interconnection and joints. In this work, a tin-based composite solder reinforced by nano-sized metallic particulates was developed, and its soldering process performance, mechanical properties of the soldered joints were characterized with a comparison to a traditional tin-lead based solder. The results show that the soldering process performance of the nano-composite solder is comparable to that of the traditional 63Sn-37Pb eutectic solder, and its soldered joints are superior to the latter in creep resistance and shear strength.
| Original language | English |
|---|---|
| Title of host publication | Composites Technologies For 2020 |
| Publisher | Woodhead Publishing Limited |
| Pages | 645-650 |
| Number of pages | 6 |
| ISBN (Print) | 9781855738317 |
| Publication status | Published - Jun 2004 |
| Externally published | Yes |
ASJC Scopus subject areas
- General Materials Science