A study of factors affecting material removal in computer-controlled bonnet polishing

Chi Fai Cheung, Zhong Chen Cao, Lai Ting Ho

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

Abstract

Computer-controlled Bonnet Polishing (CCBP) with multi-axis machining is an enabling technology which is capable of fabricating ultraprecision surfaces with sub-micrometer form accuracy and surface roughness in the nanometer range. With the increasing demands for functional enhancement, it is of paramount importance to understand how various polishing process parameters affect the ability to accurately produce a superfinished surface with geometrically dimensional shapes in the submicrometer order. As a result, this paper presents an experimental investigation of the factors affecting the material removal in bonnet polishing. The optimal process parameters and the significance of the important parameters in CCBP are identified. The results shed some light on the optimization of the CCBP.
Original languageEnglish
Title of host publicationProceedings - ASPE 2015 Annual Meeting
PublisherAmerican Society for Precision Engineering, ASPE
Pages547-550
Number of pages4
ISBN (Electronic)9781887706698
Publication statusPublished - 1 Jan 2015
Event30th Annual Meeting of the American Society for Precision Engineering, ASPE 2015 - Hyatt Regency Austin, Austin, United States
Duration: 1 Nov 20156 Nov 2015

Conference

Conference30th Annual Meeting of the American Society for Precision Engineering, ASPE 2015
Country/TerritoryUnited States
CityAustin
Period1/11/156/11/15

Keywords

  • Bonnet Polishing
  • Material removal
  • Optimization
  • Ultra-precision machining

ASJC Scopus subject areas

  • Control and Systems Engineering

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