A study of factors affecting material removal in computer-controlled bonnet polishing

Chi Fai Cheung; Zhong Chen Cao; Lai Ting Ho

A study of factors affecting material removal in computer-controlled bonnet polishing

Chi Fai Cheung, Zhong Chen Cao, Lai Ting Ho

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

Abstract

Computer-controlled Bonnet Polishing (CCBP) with multi-axis machining is an enabling technology which is capable of fabricating ultraprecision surfaces with sub-micrometer form accuracy and surface roughness in the nanometer range. With the increasing demands for functional enhancement, it is of paramount importance to understand how various polishing process parameters affect the ability to accurately produce a superfinished surface with geometrically dimensional shapes in the submicrometer order. As a result, this paper presents an experimental investigation of the factors affecting the material removal in bonnet polishing. The optimal process parameters and the significance of the important parameters in CCBP are identified. The results shed some light on the optimization of the CCBP.

Original language	English
Title of host publication	Proceedings - ASPE 2015 Annual Meeting
Publisher	American Society for Precision Engineering, ASPE
Pages	547-550
Number of pages	4
ISBN (Electronic)	9781887706698
Publication status	Published - 1 Jan 2015
Event	30th Annual Meeting of the American Society for Precision Engineering, ASPE 2015 - Hyatt Regency Austin, Austin, United States Duration: 1 Nov 2015 → 6 Nov 2015

Conference

Conference	30th Annual Meeting of the American Society for Precision Engineering, ASPE 2015
Country/Territory	United States
City	Austin
Period	1/11/15 → 6/11/15

Keywords

Bonnet Polishing
Material removal
Optimization
Ultra-precision machining

ASJC Scopus subject areas

Control and Systems Engineering

Cite this

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title = "A study of factors affecting material removal in computer-controlled bonnet polishing",

abstract = "Computer-controlled Bonnet Polishing (CCBP) with multi-axis machining is an enabling technology which is capable of fabricating ultraprecision surfaces with sub-micrometer form accuracy and surface roughness in the nanometer range. With the increasing demands for functional enhancement, it is of paramount importance to understand how various polishing process parameters affect the ability to accurately produce a superfinished surface with geometrically dimensional shapes in the submicrometer order. As a result, this paper presents an experimental investigation of the factors affecting the material removal in bonnet polishing. The optimal process parameters and the significance of the important parameters in CCBP are identified. The results shed some light on the optimization of the CCBP.",

keywords = "Bonnet Polishing, Material removal, Optimization, Ultra-precision machining",

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A study of factors affecting material removal in computer-controlled bonnet polishing. / Cheung, Chi Fai; Cao, Zhong Chen; Ho, Lai Ting.

Proceedings - ASPE 2015 Annual Meeting. American Society for Precision Engineering, ASPE, 2015. p. 547-550.

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

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AU - Cao, Zhong Chen

AU - Ho, Lai Ting

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N2 - Computer-controlled Bonnet Polishing (CCBP) with multi-axis machining is an enabling technology which is capable of fabricating ultraprecision surfaces with sub-micrometer form accuracy and surface roughness in the nanometer range. With the increasing demands for functional enhancement, it is of paramount importance to understand how various polishing process parameters affect the ability to accurately produce a superfinished surface with geometrically dimensional shapes in the submicrometer order. As a result, this paper presents an experimental investigation of the factors affecting the material removal in bonnet polishing. The optimal process parameters and the significance of the important parameters in CCBP are identified. The results shed some light on the optimization of the CCBP.

AB - Computer-controlled Bonnet Polishing (CCBP) with multi-axis machining is an enabling technology which is capable of fabricating ultraprecision surfaces with sub-micrometer form accuracy and surface roughness in the nanometer range. With the increasing demands for functional enhancement, it is of paramount importance to understand how various polishing process parameters affect the ability to accurately produce a superfinished surface with geometrically dimensional shapes in the submicrometer order. As a result, this paper presents an experimental investigation of the factors affecting the material removal in bonnet polishing. The optimal process parameters and the significance of the important parameters in CCBP are identified. The results shed some light on the optimization of the CCBP.

KW - Bonnet Polishing

KW - Material removal

KW - Optimization

KW - Ultra-precision machining

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M3 - Conference article published in proceeding or book

SP - 547

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BT - Proceedings - ASPE 2015 Annual Meeting

PB - American Society for Precision Engineering, ASPE

T2 - 30th Annual Meeting of the American Society for Precision Engineering, ASPE 2015

Y2 - 1 November 2015 through 6 November 2015

ER -

A study of factors affecting material removal in computer-controlled bonnet polishing

Abstract

Conference

Keywords

ASJC Scopus subject areas

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