Abstract
Recent demand for high-frequency and high-speed signal transmission over GHz is driving the printed circuit board (PCB) industry towards a more advanced material-based era. To meet this market demand, liquid crystal polymer (LCP) has been suggested for its predominant material characteristics, such as high temperature resistance, low moisture absorption and excellent dimensional stability. However, former experimental and theoretical studies on the fabrication technology for processing the LCP PCB at different treatment conditions are lacking. This article thus evaluates the recent development of LCP PCB process technology. Different process approaches involving in lamination, drilling, desmearing, and metallization are proposed and compared, and associated reliability testing is addressed. Experimental results are shown to demonstrate the efficacy of the proposed approach for developing the process technology of LCP PCB.
| Original language | English |
|---|---|
| Pages (from-to) | 2348-2358 |
| Number of pages | 11 |
| Journal | Journal of Applied Polymer Science |
| Volume | 116 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 15 May 2010 |
Keywords
- Liquid crystal polymer
- Printed circuit board
- Process technology
ASJC Scopus subject areas
- General Chemistry
- Surfaces, Coatings and Films
- Polymers and Plastics
- Materials Chemistry