Abstract
Lead free solders Sn3.5Ag, Sn3.8Ag0.7Cu and Sn0.7Cu using the flip-chip process baseline developed for the Sn37Pb solder were studied. It was found that small amount of Ag or Cu added in the solder gives totally different surface morphology. Furthermore, it was observed that 30°C above the melting point of the Sn37Pb, Sn3.5Ag and Sn3.8Ag0.7Cu is enough for the solder reflow, but not enough for the Sn0.7Cu solder reflow.
Original language | English |
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Pages (from-to) | 323-330 |
Number of pages | 8 |
Journal | Proceedings - Electronic Components and Technology Conference |
Publication status | Published - 17 Jul 2003 |
Externally published | Yes |
Event | 53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States Duration: 27 May 2003 → 30 May 2003 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering