A reliability comparison of lead free and eutectic solder for stencil printing based flip-chip applications

Esther W.C. Yau; J. F. Gong; Benny F.W. Hong; Philip Ching Ho Chan

A reliability comparison of lead free and eutectic solder for stencil printing based flip-chip applications

Esther W.C. Yau, J. F. Gong, Benny F.W. Hong, Philip Ching Ho Chan

Research output: Journal article publication › Conference article › Academic research › peer-review

Abstract

Lead free solders Sn3.5Ag, Sn3.8Ag0.7Cu and Sn0.7Cu using the flip-chip process baseline developed for the Sn37Pb solder were studied. It was found that small amount of Ag or Cu added in the solder gives totally different surface morphology. Furthermore, it was observed that 30°C above the melting point of the Sn37Pb, Sn3.5Ag and Sn3.8Ag0.7Cu is enough for the solder reflow, but not enough for the Sn0.7Cu solder reflow.

Original language	English
Pages (from-to)	323-330
Number of pages	8
Journal	Proceedings - Electronic Components and Technology Conference
Publication status	Published - 17 Jul 2003
Externally published	Yes
Event	53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States Duration: 27 May 2003 → 30 May 2003

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Cite this

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title = "A reliability comparison of lead free and eutectic solder for stencil printing based flip-chip applications",

abstract = "Lead free solders Sn3.5Ag, Sn3.8Ag0.7Cu and Sn0.7Cu using the flip-chip process baseline developed for the Sn37Pb solder were studied. It was found that small amount of Ag or Cu added in the solder gives totally different surface morphology. Furthermore, it was observed that 30°C above the melting point of the Sn37Pb, Sn3.5Ag and Sn3.8Ag0.7Cu is enough for the solder reflow, but not enough for the Sn0.7Cu solder reflow.",

author = "Yau, {Esther W.C.} and Gong, {J. F.} and Hong, {Benny F.W.} and Chan, {Philip Ching Ho}",

year = "2003",

month = jul,

day = "17",

language = "English",

pages = "323--330",

journal = "Proceedings - Electronic Components and Technology Conference",

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publisher = "IEEE",

note = "53rd Electronic Components and Technology Conference 2003 ; Conference date: 27-05-2003 Through 30-05-2003",

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T1 - A reliability comparison of lead free and eutectic solder for stencil printing based flip-chip applications

AU - Yau, Esther W.C.

AU - Gong, J. F.

AU - Hong, Benny F.W.

AU - Chan, Philip Ching Ho

PY - 2003/7/17

Y1 - 2003/7/17

N2 - Lead free solders Sn3.5Ag, Sn3.8Ag0.7Cu and Sn0.7Cu using the flip-chip process baseline developed for the Sn37Pb solder were studied. It was found that small amount of Ag or Cu added in the solder gives totally different surface morphology. Furthermore, it was observed that 30°C above the melting point of the Sn37Pb, Sn3.5Ag and Sn3.8Ag0.7Cu is enough for the solder reflow, but not enough for the Sn0.7Cu solder reflow.

AB - Lead free solders Sn3.5Ag, Sn3.8Ag0.7Cu and Sn0.7Cu using the flip-chip process baseline developed for the Sn37Pb solder were studied. It was found that small amount of Ag or Cu added in the solder gives totally different surface morphology. Furthermore, it was observed that 30°C above the melting point of the Sn37Pb, Sn3.5Ag and Sn3.8Ag0.7Cu is enough for the solder reflow, but not enough for the Sn0.7Cu solder reflow.

UR - http://www.scopus.com/inward/record.url?scp=0038350987&partnerID=8YFLogxK

M3 - Conference article

SN - 0569-5503

SP - 323

EP - 330

JO - Proceedings - Electronic Components and Technology Conference

JF - Proceedings - Electronic Components and Technology Conference

T2 - 53rd Electronic Components and Technology Conference 2003

Y2 - 27 May 2003 through 30 May 2003

ER -

A reliability comparison of lead free and eutectic solder for stencil printing based flip-chip applications

Abstract

ASJC Scopus subject areas

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