A reliability comparison of lead free and eutectic solder for stencil printing based flip-chip applications

Esther W.C. Yau, J. F. Gong, Benny F.W. Hong, Philip Ching Ho Chan

Research output: Journal article publicationConference articleAcademic researchpeer-review

6 Citations (Scopus)

Abstract

Lead free solders Sn3.5Ag, Sn3.8Ag0.7Cu and Sn0.7Cu using the flip-chip process baseline developed for the Sn37Pb solder were studied. It was found that small amount of Ag or Cu added in the solder gives totally different surface morphology. Furthermore, it was observed that 30°C above the melting point of the Sn37Pb, Sn3.5Ag and Sn3.8Ag0.7Cu is enough for the solder reflow, but not enough for the Sn0.7Cu solder reflow.
Original languageEnglish
Pages (from-to)323-330
Number of pages8
JournalProceedings - Electronic Components and Technology Conference
Publication statusPublished - 17 Jul 2003
Externally publishedYes
Event53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States
Duration: 27 May 200330 May 2003

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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