A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties

Keyphrases

• Microstructure 100%
• Electroplating 100%
• Intermetallic Compound Formation 100%
• Solder Bump 100%
• Flip chip 100%
• Growth Properties 100%
• Reliability Comparison 100%
• Stencil 100%
• Surface Roughness 75%
• Soldering 50%
• IMC Growth 50%
• Process Conditions 25%
• Adhesion 25%
• Grain Size 25%
• Current Density 25%
• Shear Strength 25%
• Failure Mode 25%
• Surface Morphology 25%
• Shear Test 25%
• Surface Grain 25%
• Electroplating Process 25%
• Thermal Aging Test 25%
• Cu3Sn 25%
• Zincation 25%
• Solder Ball 25%
• Diffusion Rate 25%
• Au-Ni 25%
• Humidity Testing 25%
• SnPb Solder 25%
• Ni-Au 25%
• Stencil Printing Process 25%
• Gold Diffusion 25%
• Ball Shear Strength 25%
• Cu6Sn5 25%
• Ni-Sn 25%

Engineering

• Solder Bump 100%
• Shear Strength 100%
• Intermetallics 100%
• Printing Process 50%
• Process Parameter 50%
• Process Condition 50%
• Humidity Test 50%
• Failure Mode 50%
• Eutectics 50%
• Surface Morphology 50%

Material Science

• Surface Roughness 100%
• Intermetallics 100%
• Shear Strength 66%
• Shear Testing 33%
• Thermal Aging 33%
• Surface Morphology 33%
• Plating 33%
• Electroplating 33%
• Grain Size 33%
• Density 33%