A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties

Jing Feng Gong, Philip Ching Ho Chan, Guo Wei Xiao, Ricky S W Lee, Matthew M F Yuen

Research output: Journal article publicationJournal articleAcademic researchpeer-review

6 Citations (Scopus)

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