A relaxation scheme for TSP-based 3D printing path optimizer

Kai Yin Fok; Chi Tsun Cheng; Chi Kong Tse; Nuwan Ganganath

doi:10.1109/CyberC.2016.80

A relaxation scheme for TSP-based 3D printing path optimizer

Kai Yin Fok, Chi Tsun Cheng, Chi Kong Tse, Nuwan Ganganath

The Hong Kong Polytechnic University

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

18 Citations (Scopus)

Abstract

Additive-layered manufacturing has gained attention in recent years as it has many advantages over conventional injection moulding methods. The optimization of printing trajectories can be formulated as a travelling salesman problem (TSP) and solved accordingly. However, computational complexities of ordinary TSP solvers can increase tremendously with the scale of the problem, which make them impractical. In this work, a relaxation scheme for TSP-based 3D printing path optimizer is proposed. Simulation results show that the proposed scheme can significantly shorten the computational time of the optimization process with insignificant impact on solution quality.

Original language	English
Title of host publication	Proceedings - 2016 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery, CyberC 2016
Publisher	IEEE
Pages	382-385
Number of pages	4
ISBN (Electronic)	9781509051540
DOIs	https://doi.org/10.1109/CyberC.2016.80
Publication status	Published - 23 Feb 2017
Event	8th International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery, CyberC 2016 - Ascott Raffles City, Chengdu, China Duration: 13 Oct 2016 → 15 Oct 2016

Conference

Conference	8th International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery, CyberC 2016
Country/Territory	China
City	Chengdu
Period	13/10/16 → 15/10/16

Keywords

3D printing
Additive manufacturing
Optimisation
Relaxation
TSP

ASJC Scopus subject areas

Artificial Intelligence
Computer Networks and Communications
Safety, Risk, Reliability and Quality

More information

10.1109/CyberC.2016.80

http://hdl.handle.net/10397/64537

Cite this

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title = "A relaxation scheme for TSP-based 3D printing path optimizer",

abstract = "Additive-layered manufacturing has gained attention in recent years as it has many advantages over conventional injection moulding methods. The optimization of printing trajectories can be formulated as a travelling salesman problem (TSP) and solved accordingly. However, computational complexities of ordinary TSP solvers can increase tremendously with the scale of the problem, which make them impractical. In this work, a relaxation scheme for TSP-based 3D printing path optimizer is proposed. Simulation results show that the proposed scheme can significantly shorten the computational time of the optimization process with insignificant impact on solution quality.",

keywords = "3D printing, Additive manufacturing, Optimisation, Relaxation, TSP",

author = "Fok, \{Kai Yin\} and Cheng, \{Chi Tsun\} and Tse, \{Chi Kong\} and Nuwan Ganganath",

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doi = "10.1109/CyberC.2016.80",

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booktitle = "Proceedings - 2016 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery, CyberC 2016",

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Fok, KY, Cheng, CT, Tse, CK & Ganganath, N 2017, A relaxation scheme for TSP-based 3D printing path optimizer. in Proceedings - 2016 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery, CyberC 2016., 7864265, IEEE, pp. 382-385, 8th International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery, CyberC 2016, Chengdu, China, 13/10/16. https://doi.org/10.1109/CyberC.2016.80

A relaxation scheme for TSP-based 3D printing path optimizer. / Fok, Kai Yin; Cheng, Chi Tsun; Tse, Chi Kong et al.
Proceedings - 2016 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery, CyberC 2016. IEEE, 2017. p. 382-385 7864265.

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

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AU - Cheng, Chi Tsun

AU - Tse, Chi Kong

AU - Ganganath, Nuwan

PY - 2017/2/23

Y1 - 2017/2/23

N2 - Additive-layered manufacturing has gained attention in recent years as it has many advantages over conventional injection moulding methods. The optimization of printing trajectories can be formulated as a travelling salesman problem (TSP) and solved accordingly. However, computational complexities of ordinary TSP solvers can increase tremendously with the scale of the problem, which make them impractical. In this work, a relaxation scheme for TSP-based 3D printing path optimizer is proposed. Simulation results show that the proposed scheme can significantly shorten the computational time of the optimization process with insignificant impact on solution quality.

AB - Additive-layered manufacturing has gained attention in recent years as it has many advantages over conventional injection moulding methods. The optimization of printing trajectories can be formulated as a travelling salesman problem (TSP) and solved accordingly. However, computational complexities of ordinary TSP solvers can increase tremendously with the scale of the problem, which make them impractical. In this work, a relaxation scheme for TSP-based 3D printing path optimizer is proposed. Simulation results show that the proposed scheme can significantly shorten the computational time of the optimization process with insignificant impact on solution quality.

KW - 3D printing

KW - Additive manufacturing

KW - Optimisation

KW - Relaxation

KW - TSP

UR - https://www.scopus.com/pages/publications/85015824258

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M3 - Conference article published in proceeding or book

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BT - Proceedings - 2016 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery, CyberC 2016

PB - IEEE

T2 - 8th International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery, CyberC 2016

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ER -

A relaxation scheme for TSP-based 3D printing path optimizer

Abstract

Conference

Keywords

ASJC Scopus subject areas

More information

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