Abstract
Additive-layered manufacturing has gained attention in recent years as it has many advantages over conventional injection moulding methods. The optimization of printing trajectories can be formulated as a travelling salesman problem (TSP) and solved accordingly. However, computational complexities of ordinary TSP solvers can increase tremendously with the scale of the problem, which make them impractical. In this work, a relaxation scheme for TSP-based 3D printing path optimizer is proposed. Simulation results show that the proposed scheme can significantly shorten the computational time of the optimization process with insignificant impact on solution quality.
Original language | English |
---|---|
Title of host publication | Proceedings - 2016 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery, CyberC 2016 |
Publisher | IEEE |
Pages | 382-385 |
Number of pages | 4 |
ISBN (Electronic) | 9781509051540 |
DOIs | |
Publication status | Published - 23 Feb 2017 |
Event | 8th International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery, CyberC 2016 - Ascott Raffles City, Chengdu, China Duration: 13 Oct 2016 → 15 Oct 2016 |
Conference
Conference | 8th International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery, CyberC 2016 |
---|---|
Country/Territory | China |
City | Chengdu |
Period | 13/10/16 → 15/10/16 |
Keywords
- 3D printing
- Additive manufacturing
- Optimisation
- Relaxation
- TSP
ASJC Scopus subject areas
- Artificial Intelligence
- Computer Networks and Communications
- Safety, Risk, Reliability and Quality