A relaxation scheme for TSP-based 3D printing path optimizer

Kai Yin Fok, Chi Tsun Cheng, Chi Kong Tse, Nuwan Ganganath

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

10 Citations (Scopus)

Abstract

Additive-layered manufacturing has gained attention in recent years as it has many advantages over conventional injection moulding methods. The optimization of printing trajectories can be formulated as a travelling salesman problem (TSP) and solved accordingly. However, computational complexities of ordinary TSP solvers can increase tremendously with the scale of the problem, which make them impractical. In this work, a relaxation scheme for TSP-based 3D printing path optimizer is proposed. Simulation results show that the proposed scheme can significantly shorten the computational time of the optimization process with insignificant impact on solution quality.
Original languageEnglish
Title of host publicationProceedings - 2016 International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery, CyberC 2016
PublisherIEEE
Pages382-385
Number of pages4
ISBN (Electronic)9781509051540
DOIs
Publication statusPublished - 23 Feb 2017
Event8th International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery, CyberC 2016 - Ascott Raffles City, Chengdu, China
Duration: 13 Oct 201615 Oct 2016

Conference

Conference8th International Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery, CyberC 2016
Country/TerritoryChina
CityChengdu
Period13/10/1615/10/16

Keywords

  • 3D printing
  • Additive manufacturing
  • Optimisation
  • Relaxation
  • TSP

ASJC Scopus subject areas

  • Artificial Intelligence
  • Computer Networks and Communications
  • Safety, Risk, Reliability and Quality

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