Engineering
Process Parameter
100%
Model Parameter
100%
Good Agreement
100%
Measured Result
100%
Silicon Substrate
100%
Mutual Inductance
100%
Generic Model
100%
Physical Model
100%
Analytical Model
100%
Skin Effect
100%
Proximity Effect
100%
Keyphrases
Physical Model
100%
On-chip Inductor
100%
On-chip Spiral Inductor
100%
Substrate Modeling
100%
Ladder Structure
66%
Substrate Resistivity
66%
Electric
33%
Analytical Model
33%
Inductors
33%
Metal Line
33%
Lossy
33%
Eddy Current
33%
Silicon Substrate
33%
Generic Model
33%
Physical-based
33%
Proximity Effect
33%
Skin Effect
33%
Mutual Inductance
33%
Radio-frequency Integrated Circuit (RF IC)
33%
Magnetic Losses
33%
Inductance Reduction
33%
Effective Inductance
33%