A novel transducer for photon energy detection via near-field cavity optomechanics

J. F. Tao, H. Cai, Q. X. Zhang, J. M. Tsai, P. Kropelnicki, A. B. Randles, M. Tang, A. Q. Liu

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

1 Citation (Scopus)

Abstract

This paper reports an optomechanical transducer for photon energy detection on the silicon-photonics platform. The photon energy is enhanced by a ring resonator and converted into mechanical energy via optical gradient force. An integrated electron tunneling displacement sensor is used to detect the photon-induced mechanical deformation on-chip. Compared with the traditional photon energy detection based on photon absorption, this optomechanical transducer has more compact size (60 μm × 230 μm), low thermal noise (0.03 V/°C) and low cost. And it is a silicon based device, compatible with CMOS process and easier to be integrated with silicon-photonics.

Original languageEnglish
Title of host publication2013 Transducers and Eurosensors XXVII
Subtitle of host publicationThe 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
Pages1511-1514
Number of pages4
DOIs
Publication statusPublished - 2013
Externally publishedYes
Event2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013 - Barcelona, Spain
Duration: 16 Jun 201320 Jun 2013

Publication series

Name2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013

Conference

Conference2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
Country/TerritorySpain
CityBarcelona
Period16/06/1320/06/13

Keywords

  • electron tunneling displacement sensor
  • NEMS
  • Optomechanics
  • photon energy detection
  • resonator cavity

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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