TY - JOUR
T1 - A novel ductile machining model of single-crystal silicon for freeform surfaces with large azimuthal height variation by ultra-precision fly cutting
AU - Sun, Zhanwen
AU - To, Suet
AU - Zhang, Shaojian
N1 - Funding Information:
This work was supported partially by the Research Committee of The Hong Kong Polytechnic University (Project Code: RUNS).
Publisher Copyright:
© 2018
PY - 2018/12
Y1 - 2018/12
N2 - Ultra-precision fly cutting (UPFC) is an important technology in the fabrication of freeform surfaces on single-crystal silicon. However, the insufficient understanding of the ductile machining mechanisms in UPFC of silicon under a large depth of cut highly limits the practical fabrication of freeform surfaces with large azimuthal height variation (AHV). Especially, no work has been found on studying the ductile machining model in UPFC of silicon considering both feed and step motion of the diamond tool. In this study, a novel ductile machining model in UPFC of silicon is proposed to demonstrate the superiority of UPFC on achieving the deep ductile-cut region. Experimental validation has been conducted by fabricating two kinds of freeform surfaces, namely micro-grooves and an F-theta lens, on silicon. This paper theoretically and experimentally elaborates that the chip thickness of UPFC is not only determined by the machining parameters, but also is the inversely proportional function of the swing distance of the diamond tool. Thus, by employing a large enough swing distance, much thinner chips can be generated by UPFC even when machining under large cutting depths and feed rates. Therefore, a deep ductile-cut region of silicon can be achieved by UPFC with a large swing distance. Freeform surfaces with tens of micrometers of AHV can be successfully fabricated on silicon by UPFC without the generation of brittle fractures.
AB - Ultra-precision fly cutting (UPFC) is an important technology in the fabrication of freeform surfaces on single-crystal silicon. However, the insufficient understanding of the ductile machining mechanisms in UPFC of silicon under a large depth of cut highly limits the practical fabrication of freeform surfaces with large azimuthal height variation (AHV). Especially, no work has been found on studying the ductile machining model in UPFC of silicon considering both feed and step motion of the diamond tool. In this study, a novel ductile machining model in UPFC of silicon is proposed to demonstrate the superiority of UPFC on achieving the deep ductile-cut region. Experimental validation has been conducted by fabricating two kinds of freeform surfaces, namely micro-grooves and an F-theta lens, on silicon. This paper theoretically and experimentally elaborates that the chip thickness of UPFC is not only determined by the machining parameters, but also is the inversely proportional function of the swing distance of the diamond tool. Thus, by employing a large enough swing distance, much thinner chips can be generated by UPFC even when machining under large cutting depths and feed rates. Therefore, a deep ductile-cut region of silicon can be achieved by UPFC with a large swing distance. Freeform surfaces with tens of micrometers of AHV can be successfully fabricated on silicon by UPFC without the generation of brittle fractures.
KW - Freeform surface
KW - Micro-groove
KW - Single-crystal silicon
KW - Ultra-precision fly cutting
UR - http://www.scopus.com/inward/record.url?scp=85051642454&partnerID=8YFLogxK
U2 - 10.1016/j.ijmachtools.2018.07.005
DO - 10.1016/j.ijmachtools.2018.07.005
M3 - Journal article
AN - SCOPUS:85051642454
SN - 0890-6955
VL - 135
SP - 1
EP - 11
JO - International Journal of Machine Tool Design & Research
JF - International Journal of Machine Tool Design & Research
ER -