Abstract
Stress sensing chips have been developed for some time and is an invaluable tool for structural analysis of electronic packages. It can be used for in-situ and realtime measurement of thermally induced stress on the die surface. Four-point-bending calibration, wafer-level calibration and hydrostatic calibration have been previously used to calibrate the stress sensing chip. These methods are used to calibrate different piezoresistive coefficients B1, B2or their combinations (B1-B2), (B1+B2) and (B1+B2+B3). Among them, hydrostatic calibration is a bottleneck to quick calibration. Only one chip can be calibrated at a time and the chip must be wire-bonded. Also, the value of coefficients (B1+B2+B3) obtained is non-temperature compensated and it requires precise temperature measurement. Therefore, a quick and accurate calibration method is key to make stress sensing chip more acceptable by users in electronic packaging. In this paper, a new design of (111) stress sensing chip is presented. An innovative calibration scheme is proposed to accelerate the calibration process. The calibration can be done at wafer-level resulting in substantial savings in calibration time compared to calibration in die form. Its mechanism is based on thermal expansion of the aluminum micro-beams which produce out-of-plane shear stresses on the sensing elements under temperature change. The relationship of normalized resistance change against temperature was obtained from experiments. Results show that stresses produced by the aluminum micro-beam are high enough for calibration, with 4.6-5.4% difference of normalized resistance changes between resistors with and without micro-beam. Also, a simple one-dimensional theoretical model was proposed to primarily estimate the order of magnitude of the stress under temperature change.
Original language | English |
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Title of host publication | International Symposium on Electronic Materials and Packaging, EMAP 2000 |
Publisher | IEEE |
Pages | 457-463 |
Number of pages | 7 |
ISBN (Electronic) | 0780366549, 9780780366541 |
DOIs | |
Publication status | Published - 1 Jan 2000 |
Externally published | Yes |
Event | International Symposium on Electronic Materials and Packaging, EMAP 2000 - Hong Kong, Hong Kong Duration: 30 Nov 2000 → 2 Dec 2000 |
Conference
Conference | International Symposium on Electronic Materials and Packaging, EMAP 2000 |
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Country/Territory | Hong Kong |
City | Hong Kong |
Period | 30/11/00 → 2/12/00 |
ASJC Scopus subject areas
- General Engineering