A new stress chip design for electronic packaging applications

W. L.W. Hau, M. M.F. Yuen, G. Z. Yan, Philip Ching Ho Chan

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

14 Citations (Scopus)

Abstract

Stress sensing chips have been developed for some time and is an invaluable tool for structural analysis of electronic packages. It can be used for in-situ and realtime measurement of thermally induced stress on the die surface. Four-point-bending calibration, wafer-level calibration and hydrostatic calibration have been previously used to calibrate the stress sensing chip. These methods are used to calibrate different piezoresistive coefficients B1, B2or their combinations (B1-B2), (B1+B2) and (B1+B2+B3). Among them, hydrostatic calibration is a bottleneck to quick calibration. Only one chip can be calibrated at a time and the chip must be wire-bonded. Also, the value of coefficients (B1+B2+B3) obtained is non-temperature compensated and it requires precise temperature measurement. Therefore, a quick and accurate calibration method is key to make stress sensing chip more acceptable by users in electronic packaging. In this paper, a new design of (111) stress sensing chip is presented. An innovative calibration scheme is proposed to accelerate the calibration process. The calibration can be done at wafer-level resulting in substantial savings in calibration time compared to calibration in die form. Its mechanism is based on thermal expansion of the aluminum micro-beams which produce out-of-plane shear stresses on the sensing elements under temperature change. The relationship of normalized resistance change against temperature was obtained from experiments. Results show that stresses produced by the aluminum micro-beam are high enough for calibration, with 4.6-5.4% difference of normalized resistance changes between resistors with and without micro-beam. Also, a simple one-dimensional theoretical model was proposed to primarily estimate the order of magnitude of the stress under temperature change.
Original languageEnglish
Title of host publicationInternational Symposium on Electronic Materials and Packaging, EMAP 2000
PublisherIEEE
Pages457-463
Number of pages7
ISBN (Electronic)0780366549, 9780780366541
DOIs
Publication statusPublished - 1 Jan 2000
Externally publishedYes
EventInternational Symposium on Electronic Materials and Packaging, EMAP 2000 - Hong Kong, Hong Kong
Duration: 30 Nov 20002 Dec 2000

Conference

ConferenceInternational Symposium on Electronic Materials and Packaging, EMAP 2000
CountryHong Kong
CityHong Kong
Period30/11/002/12/00

ASJC Scopus subject areas

  • Engineering(all)

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