A minimum viable mission profile emulator for IGBT modules in modular multilevel converters

Zhongxu Wang; Huai Wang; Yi Zhang; Frede Blaabjerg

doi:10.1109/APEC.2019.8721785

A minimum viable mission profile emulator for IGBT modules in modular multilevel converters

Zhongxu Wang
, Huai Wang
, Yi Zhang
, Frede Blaabjerg

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

Abstract

Various methods have been presented to emulate the electrical behavior of Modular Multilevel Converters (MMCs). To meet the demands for reliability aspect study of MMCs, this paper proposes a minimum viable setup to emulate the thermal behavior and investigates its feasibility for reliability testing. The proposed mission profile emulator has three distinctive features: 1) capable of emulating and measuring the thermal stresses of power modules; 2) capable of implementing practical switching profiles as a full-scale MMC; and 3) with significantly reduced requirement for dc power supply compared to existing setups used for electrical aspect study. Theoretical discussions and experimental measurements are presented to demonstrate the capability of the mission profile emulator.

Original language	English
Title of host publication	34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	313-318
Number of pages	6
ISBN (Electronic)	9781538683309
DOIs	https://doi.org/10.1109/APEC.2019.8721785
Publication status	Published - 24 May 2019
Event	34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 - Anaheim, United States Duration: 17 Mar 2019 → 21 Mar 2019

Publication series

Name	Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
Volume	2019-March

Conference

Conference	34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
Country/Territory	United States
City	Anaheim
Period	17/03/19 → 21/03/19

ASJC Scopus subject areas

Electrical and Electronic Engineering

More information

10.1109/APEC.2019.8721785

Cite this

Wang, Z., Wang, H., Zhang, Y., & Blaabjerg, F. (2019). A minimum viable mission profile emulator for IGBT modules in modular multilevel converters. In 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 (pp. 313-318). Article 8721785 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC; Vol. 2019-March). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APEC.2019.8721785

Wang, Zhongxu ; Wang, Huai ; Zhang, Yi et al. / A minimum viable mission profile emulator for IGBT modules in modular multilevel converters. 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 313-318 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC).

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abstract = "Various methods have been presented to emulate the electrical behavior of Modular Multilevel Converters (MMCs). To meet the demands for reliability aspect study of MMCs, this paper proposes a minimum viable setup to emulate the thermal behavior and investigates its feasibility for reliability testing. The proposed mission profile emulator has three distinctive features: 1) capable of emulating and measuring the thermal stresses of power modules; 2) capable of implementing practical switching profiles as a full-scale MMC; and 3) with significantly reduced requirement for dc power supply compared to existing setups used for electrical aspect study. Theoretical discussions and experimental measurements are presented to demonstrate the capability of the mission profile emulator.",

author = "Zhongxu Wang and Huai Wang and Yi Zhang and Frede Blaabjerg",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019 ; Conference date: 17-03-2019 Through 21-03-2019",

year = "2019",

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doi = "10.1109/APEC.2019.8721785",

language = "English",

series = "Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC",

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Wang, Z, Wang, H, Zhang, Y & Blaabjerg, F 2019, A minimum viable mission profile emulator for IGBT modules in modular multilevel converters. in 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019., 8721785, Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, vol. 2019-March, Institute of Electrical and Electronics Engineers Inc., pp. 313-318, 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019, Anaheim, United States, 17/03/19. https://doi.org/10.1109/APEC.2019.8721785

A minimum viable mission profile emulator for IGBT modules in modular multilevel converters. / Wang, Zhongxu; Wang, Huai; Zhang, Yi et al.
34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 313-318 8721785 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC; Vol. 2019-March).

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

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Wang Z, Wang H, Zhang Y, Blaabjerg F. A minimum viable mission profile emulator for IGBT modules in modular multilevel converters. In 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 313-318. 8721785. (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC). doi: 10.1109/APEC.2019.8721785

A minimum viable mission profile emulator for IGBT modules in modular multilevel converters

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