A hybrid laser integration approach for miniature photonic sensors

Jifang Tao; Chong Ser Choong; Tao Sun; Hong Cai; Navab Singh; Yuandong Gu

doi:10.1109/EPTC.2018.8654448

A hybrid laser integration approach for miniature photonic sensors

Jifang Tao, Chong Ser Choong, Tao Sun, Hong Cai, Navab Singh, Yuandong Gu

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

Abstract

Hybrid laser integration with optical MEMS chips and silicon photonic (SiP) circuits are important for many miniature devices, such as micro-sensor, optical transmitter module. Here, we demonstrated a flexible approach for hybrid integrating laser chip onto silicon device by use of flip-chip bonding method to build a MEMS tunable laser and a miniature silicon optical bench (SiOB) for SiP devices. The maximum coupling efficiency is up to 76.5% and 81.5% for these two devices, respectively. It provides a low cost, miniature, and reliable solution for large-scale deployments Place abstract here: usually a single paragraph summarizing the problem, approach, and results that are in the paper.

Original language	English
Title of host publication	2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	944-947
Number of pages	4
ISBN (Electronic)	9781538676684
DOIs	https://doi.org/10.1109/EPTC.2018.8654448
Publication status	Published - Dec 2018
Externally published	Yes
Event	20th IEEE Electronics Packaging Technology Conference, EPTC 2018 - Singapore, Singapore Duration: 4 Dec 2018 → 7 Dec 2018

Publication series

Name	2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018

Conference

Conference	20th IEEE Electronics Packaging Technology Conference, EPTC 2018
Country/Territory	Singapore
City	Singapore
Period	4/12/18 → 7/12/18

ASJC Scopus subject areas

Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Safety, Risk, Reliability and Quality
Electronic, Optical and Magnetic Materials
Instrumentation
Atomic and Molecular Physics, and Optics

More information

10.1109/EPTC.2018.8654448

Cite this

Tao, J., Choong, C. S., Sun, T., Cai, H., Singh, N., & Gu, Y. (2018). A hybrid laser integration approach for miniature photonic sensors. In 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018 (pp. 944-947). Article 8654448 (2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPTC.2018.8654448

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abstract = "Hybrid laser integration with optical MEMS chips and silicon photonic (SiP) circuits are important for many miniature devices, such as micro-sensor, optical transmitter module. Here, we demonstrated a flexible approach for hybrid integrating laser chip onto silicon device by use of flip-chip bonding method to build a MEMS tunable laser and a miniature silicon optical bench (SiOB) for SiP devices. The maximum coupling efficiency is up to 76.5% and 81.5% for these two devices, respectively. It provides a low cost, miniature, and reliable solution for large-scale deployments Place abstract here: usually a single paragraph summarizing the problem, approach, and results that are in the paper.",

author = "Jifang Tao and Choong, {Chong Ser} and Tao Sun and Hong Cai and Navab Singh and Yuandong Gu",

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language = "English",

series = "2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018",

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Tao, J, Choong, CS, Sun, T, Cai, H, Singh, N & Gu, Y 2018, A hybrid laser integration approach for miniature photonic sensors. in 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018., 8654448, 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018, Institute of Electrical and Electronics Engineers Inc., pp. 944-947, 20th IEEE Electronics Packaging Technology Conference, EPTC 2018, Singapore, Singapore, 4/12/18. https://doi.org/10.1109/EPTC.2018.8654448

A hybrid laser integration approach for miniature photonic sensors. / Tao, Jifang; Choong, Chong Ser; Sun, Tao et al.
2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 944-947 8654448 (2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018).

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

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AB - Hybrid laser integration with optical MEMS chips and silicon photonic (SiP) circuits are important for many miniature devices, such as micro-sensor, optical transmitter module. Here, we demonstrated a flexible approach for hybrid integrating laser chip onto silicon device by use of flip-chip bonding method to build a MEMS tunable laser and a miniature silicon optical bench (SiOB) for SiP devices. The maximum coupling efficiency is up to 76.5% and 81.5% for these two devices, respectively. It provides a low cost, miniature, and reliable solution for large-scale deployments Place abstract here: usually a single paragraph summarizing the problem, approach, and results that are in the paper.

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Tao J, Choong CS, Sun T, Cai H, Singh N, Gu Y. A hybrid laser integration approach for miniature photonic sensors. In 2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018. Institute of Electrical and Electronics Engineers Inc. 2018. p. 944-947. 8654448. (2018 IEEE 20th Electronics Packaging Technology Conference, EPTC 2018). doi: 10.1109/EPTC.2018.8654448

A hybrid laser integration approach for miniature photonic sensors

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