A finite strip loaded by a bonded-rivet of a different material

K. C. Ho, Kam Tim Chau

Research output: Journal article publicationJournal articleAcademic researchpeer-review

6 Citations (Scopus)

Abstract

This paper investigates the maximum stress concentrations in a finite strip loaded by a bonded elastic rivet by using the complex variable method in conjunction with the least-square boundary collocation method (BCM). The rivet-load is modeled by a uniform distributed body force; and the resultant rivet-force is acting along the transverse direction. The accuracy of the BCM is checked by comparing the results to those of the finite element method for a specific finite geometry of a strip and by the exact solution for the case of an infinite plane. Numerical results show that the maximum shear and hoop stresses at the interface decrease with increasing b/R, where b is half of the width of the strip and R is the radius of the rivet. The maximum shear stress at the interface increases with ζ=μ2/μ1(where μ1and μ2are the shear moduli of the strip and rivet respectively) while the maximum hoop stress decreases with ζ. For ζ≥1, the maximum normal bond stress at the interface decreases initially to a local minimum before rising to a steady value as b/R further increases. As b/R increases, the angular location of maximum stress occurrence θmax, which is measured from the direction of resultant rivet-force, increases from about 36°42° to 90° (the infinite plane limit) for the shear bond stress, and jumps suddenly from a roughly constant value (50°55°) to 0° (the infinite plane limit) for the normal bond stress. Similar sudden shifts in the angular location of maximum stress are also observed in the hoop stress at the interface.
Original languageEnglish
Pages (from-to)203-218
Number of pages16
JournalComputers and Structures
Volume70
Issue number2
DOIs
Publication statusPublished - 1 Jan 1999

Keywords

  • BCM
  • Finite strip
  • Stress

ASJC Scopus subject areas

  • Civil and Structural Engineering
  • Modelling and Simulation
  • Materials Science(all)
  • Mechanical Engineering
  • Computer Science Applications

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