A Final Report on Thermal Conductive Dielectric Materials used for Metal Core Printed Circuit Boards, The Hong Kong Polytechnic University (ISBN 978-962-86893-4-7)

Kam Chuen Yung; Tai Man Yue; S.L. TAM; C.P. LEE; C.K. WONG; Y.L. LO

A Final Report on Thermal Conductive Dielectric Materials used for Metal Core Printed Circuit Boards, The Hong Kong Polytechnic University (ISBN 978-962-86893-4-7)

Kam Chuen Yung
, Tai Man Yue
, S.L. TAM
, C.P. LEE
, C.K. WONG
, Y.L. LO

Research output: Creative and literary works / consulting reports / case studies › Consulting or contract research report

Original language	English
Media of output	Printed matter
Size	47 pages
Publication status	Published - 2007

Cite this

@misc{93e43a4ecff1414f8d9c38ab883595ba,

title = "A Final Report on Thermal Conductive Dielectric Materials used for Metal Core Printed Circuit Boards, The Hong Kong Polytechnic University (ISBN 978-962-86893-4-7)",

author = "Yung, \{Kam Chuen\} and Yue, \{Tai Man\} and S.L. TAM and C.P. LEE and C.K. WONG and Y.L. LO",

year = "2007",

language = "English",

}