A Dual-Band Outphaisng Power Amplifier Based on Multi-Topology Fitting

Jiayu Huang, Shichang Chen, Jialin Cai, Kuiwen Xu, Gaofeng Wang, Xinyu Zhou

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

1 Citation (Scopus)

Abstract

This paper presents the design of a dual-band outphasing power amplifier (OPA) using a new method based on multiple topology fitting based on non-commensurate transmission lines (NCTLs) and extended transmission lines (ETLs). The proposed method enables flexible and efficient design of dual-band OPA by fitting the electrical lengths and characteristic impedance of each branch network at both bands. An OPA prototype operating at 2.6 and 3.5 GHz was fabricated using two 10W GaN HEMT transistors to verify the concept. Test results show that the realized power amplifier achieves maximum output power of 44.4 and 44.3 dBm and peak drain efficiencies of 69.5% and 69.2% at these two bands. The corresponding efficiencies of 62.4% and 63.5% are obtained at the 6-dB power back-off points, respectively.

Original languageEnglish
Title of host publication2023 IEEE MTT-S International Wireless Symposium, IWS 2023 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-3
Number of pages3
ISBN (Electronic)9798350336535
DOIs
Publication statusPublished - May 2023
Event2023 IEEE MTT-S International Wireless Symposium, IWS 2023 - Qingdao, China
Duration: 14 May 202317 May 2023

Publication series

Name2023 IEEE MTT-S International Wireless Symposium, IWS 2023 - Proceedings

Conference

Conference2023 IEEE MTT-S International Wireless Symposium, IWS 2023
Country/TerritoryChina
CityQingdao
Period14/05/2317/05/23

Keywords

  • Dual-band
  • efficiency
  • outphasing
  • power amplifier (PA)

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Instrumentation

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