Abstract
以镍、钴、钯镀层作为铜基体镀金的防渗铜中间层可以有效地防止铜原子扩散到金属表面。采用SEM、EDAX、XRD等方法研究铜在该 3种金属内的扩散机理和扩散系数 ,探讨了扩散过程与这 3种金属晶体结构、晶粒大小以及X -射线衍射特性的关系。||Nickel, cobalt and palladium electrodeposits used as barrier layer between copper basis and gold deposit can effectively reduce migration of copper atom to gold upper deposit. The diffusion mechanism and diffusion coefficient of copper in the three metals were studied by means of SEM, EDAX and X-ray diffraction. The relationship between the diffusion process and the crystalline structure, grain size, X ray diffraction properties of the three metals were also discussed.
| Original language | Chinese (Simplified) |
|---|---|
| Pages (from-to) | 4-7 |
| Number of pages | 4 |
| Journal | 电镀与涂饰 (Electroplating & finishing) |
| Volume | 19 |
| Issue number | 4 |
| Publication status | Published - 2000 |
Keywords
- Metal diffusion
- Copper barrier layer
- Nickel
- Cobalt
- Palladium
- Electroplating