Abstract
The interface crack problem of a bimaterial thermopiezoelectric solid was treated byapplying the extended version of Strohs formalism and singular integral equation approach. Theinterface crack considered is subjected to combined thermal, mechanical and electric loads.Under the applied loading, the interface crack is assumed to be partially opened. Formulation ofthe problem results in a set of singular integral equations which are solved numerically. Thestudy shows that the contact zone is extremely small in comparison with the crack length. Basedon the formulation, some physically meaningful quantities of interest such as stress intensityfactors and size of contact zone for a particular material group are analyzed.
Original language | English |
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Pages (from-to) | 2463-2479 |
Number of pages | 17 |
Journal | International Journal of Solids and Structures |
Volume | 36 |
Issue number | 16 |
DOIs | |
Publication status | Published - 8 Jan 1999 |
Externally published | Yes |
ASJC Scopus subject areas
- Modelling and Simulation
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
- Applied Mathematics