A closed crack tip model for interface cracks inthermopiezoelectric materials

Qing Hua Qin, Yiu Wing Mai

Research output: Journal article publicationJournal articleAcademic researchpeer-review

85 Citations (Scopus)

Abstract

The interface crack problem of a bimaterial thermopiezoelectric solid was treated byapplying the extended version of Strohs formalism and singular integral equation approach. Theinterface crack considered is subjected to combined thermal, mechanical and electric loads.Under the applied loading, the interface crack is assumed to be partially opened. Formulation ofthe problem results in a set of singular integral equations which are solved numerically. Thestudy shows that the contact zone is extremely small in comparison with the crack length. Basedon the formulation, some physically meaningful quantities of interest such as stress intensityfactors and size of contact zone for a particular material group are analyzed.

Original languageEnglish
Pages (from-to)2463-2479
Number of pages17
JournalInternational Journal of Solids and Structures
Volume36
Issue number16
DOIs
Publication statusPublished - 8 Jan 1999
Externally publishedYes

ASJC Scopus subject areas

  • Modelling and Simulation
  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering
  • Applied Mathematics

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