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3D System-on-Packaging Using Through Silicon Via on SOI for High-Speed Optcal Interconnections with Silicon Photonics Devices for Application of 400 Gbps and beyond

  • Do Won Kim
  • , Hong Yu Li
  • , Ka Fai Chang
  • , Woon Leng Loh
  • , Ser Choong Chong
  • , Hong Cai
  • , Bhattacharya Surya

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

16   Link opens in a new tab Citations (Scopus)

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