3D System-on-Packaging Using Through Silicon Via on SOI for High-Speed Optcal Interconnections with Silicon Photonics Devices for Application of 400 Gbps and beyond
Do Won Kim, Hong Yu Li, Ka Fai Chang, Woon Leng Loh, Ser Choong Chong, Hong Cai, Bhattacharya Surya
Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review
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