3D LED and IC wafer level packaging

John Lau, Ricky Lee, Matthew Yuen, Philip Ching Ho Chan

Research output: Journal article publicationJournal articleAcademic researchpeer-review

54 Citations (Scopus)


Purpose - The purpose of this paper is to propose new 3D light emitting diodes (LED) and integrated circuits (IC) integration packages. Design/methodology/approach - These packages consist of the multi-LEDs and active IC chip such as the application specific IC, LED driver, processor, memory, radio frequency, sensor, or power controller in a 3D manner. The assembly processes of these packages are also presented and discussed. Findings - The advantages of these 3D integration packages are found to be: better performance, lower cost, less footprint, lighter package, and smaller form factor. Originality/value - A thermal management system for 3D IC and LEDs integration packages is proposed.
Original languageEnglish
Pages (from-to)98-105
Number of pages8
JournalMicroelectronics International
Issue number2
Publication statusPublished - 28 May 2010
Externally publishedYes


  • Integrated circuits
  • Light-emitting diodes
  • Packaging

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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