3D LED and IC wafer level packaging

John Lau; Ricky Lee; Matthew Yuen; Philip Ching Ho Chan

doi:10.1108/13565361011034786

3D LED and IC wafer level packaging

John Lau, Ricky Lee, Matthew Yuen, Philip Ching Ho Chan

Research output: Journal article publication › Journal article › Academic research › peer-review

62 Citations (Scopus)

Abstract

Purpose - The purpose of this paper is to propose new 3D light emitting diodes (LED) and integrated circuits (IC) integration packages. Design/methodology/approach - These packages consist of the multi-LEDs and active IC chip such as the application specific IC, LED driver, processor, memory, radio frequency, sensor, or power controller in a 3D manner. The assembly processes of these packages are also presented and discussed. Findings - The advantages of these 3D integration packages are found to be: better performance, lower cost, less footprint, lighter package, and smaller form factor. Originality/value - A thermal management system for 3D IC and LEDs integration packages is proposed.

Original language	English
Pages (from-to)	98-105
Number of pages	8
Journal	Microelectronics International
Volume	27
Issue number	2
DOIs	https://doi.org/10.1108/13565361011034786
Publication status	Published - 28 May 2010
Externally published	Yes

Keywords

Integrated circuits
Light-emitting diodes
Packaging

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Surfaces, Coatings and Films
Electrical and Electronic Engineering

More information

10.1108/13565361011034786

Cite this

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AU - Lee, Ricky

AU - Yuen, Matthew

AU - Chan, Philip Ching Ho

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AB - Purpose - The purpose of this paper is to propose new 3D light emitting diodes (LED) and integrated circuits (IC) integration packages. Design/methodology/approach - These packages consist of the multi-LEDs and active IC chip such as the application specific IC, LED driver, processor, memory, radio frequency, sensor, or power controller in a 3D manner. The assembly processes of these packages are also presented and discussed. Findings - The advantages of these 3D integration packages are found to be: better performance, lower cost, less footprint, lighter package, and smaller form factor. Originality/value - A thermal management system for 3D IC and LEDs integration packages is proposed.

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3D LED and IC wafer level packaging

Abstract

Keywords

ASJC Scopus subject areas

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