3D integrated circuit using large grain polysilicon film

V. W.C. Chan, Philip Ching Ho Chan, Mansun Chan

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

2 Citations (Scopus)

Fingerprint

Dive into the research topics of '3D integrated circuit using large grain polysilicon film'. Together they form a unique fingerprint.

Keyphrases

Material Science

Engineering