含分层复合材料层合板的接触阻尼特性

Translated title of the contribution: Contact damping characteristics of delaminated composite plates

Yi He, Yi Xiao, Zhongqing Su

Research output: Journal article publicationJournal articleAcademic researchpeer-review

Abstract

Damping performance is a high-sensitivity dynamic parameter that can be utilized to identify delamination. The damping of the delaminated composite plates contains material damping and contact damping, material damping was calculated based on the strain energy method, and contact damping was analyzed by a static-slip-integrated friction energy-dissipated model. The finite element models (FEMs) were developed by using the Abaqus software to simulate the dynamic responses of delaminated composite plates, in which, the normal contact stiffness and contact damping were introduced via the penalty stiffness method and equivalent viscous damping, respectively. The free decay test was set up to measure the dynamic parameters of the plates with different delamination sizes and locations in thickness direction. The results show that the higher the delamination ratio is, the more the first-order modal damping of the laminate rises, and the contact damping plays a major role in the rising. The experimental results are in good agreement with the FEMs' results, which verifies the rationality and accuracy of the FEMs.

Translated title of the contributionContact damping characteristics of delaminated composite plates
Original languageChinese
Pages (from-to)8-17 and 47
JournalZhendong yu Chongji/Journal of Vibration and Shock
Volume38
Issue number24
DOIs
Publication statusPublished - 28 Dec 2019

Keywords

  • Contact damping
  • Delamination
  • Finite element analysis
  • Laminated composites
  • Penalty stiffness method

ASJC Scopus subject areas

  • Mechanics of Materials
  • Acoustics and Ultrasonics
  • Mechanical Engineering

Fingerprint

Dive into the research topics of 'Contact damping characteristics of delaminated composite plates'. Together they form a unique fingerprint.

Cite this