TechConnect Innovation Award

  • Hu, Hong (Recipient)

    Prize: Prize (research)


    This award has been won at the TechConnect World Innovation Conference and Expo 2022 (TechConnect) – the world's largest multi-sector event for fostering the development and commercialisation of innovations in the areas of artificial intelligence (AI), materials science and biotechnology for a new type of “Moisture-Absorbing and Sweat-Releasing Multilayer Polylactic Acid Fabric and Manufacturing Technology” developed in an ITF project. For details, please visit

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    Degree of recognitionInternational
    Granting OrganisationsTechConnect

    Awarded at event

    Event titleTechConnect World Innovation Conference and Expo 2022
    LocationWashington DC, Washington, United StatesShow on map
    Period13 Jun 2022 → 15 Jun 2022