Event title | TechConnect World Innovation Conference and Expo 2022 |
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Location | Washington DC, Washington, United StatesShow on map |
Period | 13 Jun 2022 → 15 Jun 2022 |
TechConnect Innovation Award
- Hu, Hong (Recipient)
Prize: Prize (research)
Prize: Prize (research)
Event title | TechConnect World Innovation Conference and Expo 2022 |
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Location | Washington DC, Washington, United StatesShow on map |
Period | 13 Jun 2022 → 15 Jun 2022 |