TechConnect Innovation Award

  • Hu, Hong (Recipient)

    Prize: Prize (research)

    Description

    This award has been won at the TechConnect World Innovation Conference and Expo 2022 (TechConnect) – the world's largest multi-sector event for fostering the development and commercialisation of innovations in the areas of artificial intelligence (AI), materials science and biotechnology for a new type of “Moisture-Absorbing and Sweat-Releasing Multilayer Polylactic Acid Fabric and Manufacturing Technology” developed in an ITF project. For details, please visit https://mp.weixin.qq.com/s/cF_l6PKUEw84XxsbXRQn7Q.

    Many medias also reported this event.
    LinkedIn
    RIO https://www.linkedin.com/posts/polyuinnovation_polyu-techconnect-covid-activity-6933057589748400131-9c0t?utm_source=linkedin_share&utm_medium=member_desktop_web
    PolyU https://www.linkedin.com/posts/hong-kong-polytechnic-university_polyu-artificialintelligence-materialsscience-activity-6933362311944372224-WxbM?utm_source=linkedin_share&utm_medium=member_desktop_web

    Other media coverage
    Intellasia - https://polyu.me/3G2mslK
    Quamnet - https://polyu.me/3Lpg3SM
    Wen Wei Po - https://polyu.me/3G34D5V
    Hong Kong Commercial Daily - https://polyu.me/3wBTbLP
    Bauhinia - https://polyu.me/39FI6QM
    Sina - https://polyu.me/3G3F0C5
    Sohu - https://polyu.me/3lx1WA4
    Yidianzixun - https://polyu.me/3wGLpyH

    Degree of recognitionInternational
    Granting OrganisationsTechConnect

    Awarded at event

    Event titleTechConnect World Innovation Conference and Expo 2022
    LocationWashington DC, Washington, United StatesShow on map
    Period13 Jun 2022 → 15 Jun 2022

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