| Event title | TechConnect World Innovation Conference and Expo 2022 |
|---|---|
| Location | Washington DC, Washington, United StatesShow on map |
| Period | 13 Jun 2022 → 15 Jun 2022 |
TechConnect 2022 Innovation Award
- Cai, Jing (Recipient)
Prize: Prize (research)
Prize: Prize (research)
| Event title | TechConnect World Innovation Conference and Expo 2022 |
|---|---|
| Location | Washington DC, Washington, United StatesShow on map |
| Period | 13 Jun 2022 → 15 Jun 2022 |