Seoul International Invention Fair 2002: Gold Award Project: Advanced Composite Materials for IC and Microelectronic Wire-bonders.

  • CHAN, H. L. W. (Recipient), Or, S. W. (Recipient), CHENG, K. C. (Recipient) & CHOY, C. L. (Recipient)

Prize: Prize (research)

Granting OrganisationsKorea Invention Promotion Association

Awarded at event

Event titleSeoul International Invention Fair
Location, Seoul, Korea, Republic of
Period1 Dec 2002