Seoul International Invention Fair 2002: Gold Award Project: Advanced Composite Materials for IC and Microelectronic Wire-bonders.

  • CHAN, H.L.W. (Recipient), Or, Siu Wing (Recipient), CHENG, K.C. (Recipient) & CHOY, C.L. (Recipient)

Prize: Prize (research)

Awarded dateDec 2002
Granting OrganisationsKorea Invention Promotion Association

Awarded at event

Event titleSeoul International Invention Fair
Location, Seoul, Korea, Republic ofShow on map
Period1 Dec 2002