Gold Medal

  • Or, Siu Wing (Recipient), CHAN, LAI WA HELEN (Recipient) & WONG, HO CHI (Recipient)

Prize: Prize (research)

Description

Project Title: Novel Ultrasonic Semiconductor Thin-Die Bonding Process
Awarded dateApr 2009

Awarded at event

Event title37th International Exhibition of Inventions, New Techniques and Products
Location, Geneva, SwitzerlandShow on map
Period1 Apr 2009

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