Gold Medal

  • Or, S. W. (Recipient), CHAN, L. W. H. (Recipient) & WONG, H. C. (Recipient)

Prize: Prize (research)

Description

Project Title: Novel Ultrasonic Semiconductor Thin-Die Bonding Process

Awarded at event

Event title37th International Exhibition of Inventions, New Techniques and Products
Location, Geneva, Switzerland
Period1 Apr 2009