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Excellent Paper Award
Lee, Wing Bun (Recipient),
Cheung, Chi Fai
(Recipient),
To, Suet
(Recipient), KONG, Lingbao (Recipient) & JIANG, Jinbo (Recipient)
The Hong Kong Polytechnic University
Department of Industrial and Systems Engineering
Prize
:
Prize (research)
Description
60th Anniversary of Chinese Journal of Mechanical Engineering
Awarded date
Oct 2013
Granting Organisations
Chinese Mechanical Engineering Society
Fingerprint
Mechanical Engineering
100%
Chinese Journals
100%
60th Anniversary
100%
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