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3rd Asia Exhibition of Innovations and Inventions Hong Kong (Silver Medal)
Lee, Wing Bun (Recipient)
Department of Industrial and Systems Engineering
Prize
:
Prize (research)
Description
Light Field Microscope Imaging and 3D Visualizing System
Awarded date
8 Dec 2023
Degree of recognition
Local
Granting Organisations
The Hong Kong Exporters' Association
Fingerprint
Hong Kong
100%
Asia
100%
Microscopic Imaging
100%
Light Field Microscope
100%
Visualizing System
100%
silver medal
100%
Imaging
100%
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