Event title | 37th International Exhibition of Inventions, New Techniques and Products |
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Location | , Geneva, SwitzerlandShow on map |
Period | 1 Apr 2009 |
37th International Exhibition of Inventions, New Techniques and Products: Gold Award Project: Ultrasonic semiconductor thin-die bonding platform (超薄半導體集成電路晶片管芯焊接超聲技術平台) [1-5 April 2009, Geneva, Switzerland]
- Or, S. W. (Recipient), CHAN, H. L. W. (Recipient), WONG, H. C. (Recipient) & WONG, S. Y. (Recipient)
Prize: Prize (research)