37th International Exhibition of Inventions, New Techniques and Products: Gold Award Project: Ultrasonic semiconductor thin-die bonding platform (超薄半導體集成電路晶片管芯焊接超聲技術平台) [1-5 April 2009, Geneva, Switzerland]

  • Or, Siu Wing (Recipient), CHAN, H.L.W. (Recipient), WONG, H.C. (Recipient) & WONG, S.Y. (Recipient)

Prize: Prize (research)

Awarded dateApr 2009

Awarded at event

Event title37th International Exhibition of Inventions, New Techniques and Products
Location, Geneva, SwitzerlandShow on map
Period1 Apr 2009