Personal profile
Education/Academic qualification
Bachelor of Engineering in Electronic and Communication Engineering, City University of Hong Kong
Bachelor of Business Administration in Marketing, The Hong Kong Polytechnic University
Bachelor of Engineering in Industrial and System Engineering, The Hong Kong Polytechnic University
Doctor of Philosophy, The Hong Kong Polytechnic University
Fingerprint
- 1 Similar Profiles
Collaborations and top research areas from the last five years
Research output
-
Analysing surface quality evolution and cutting forces in micro-milling of Ti6Al4V using experimental and machine learning approaches
Rehan, M., Sana, M., Farooq, M. U., Yip, W. S. & To, S., Jan 2026, In: International Journal of Advanced Manufacturing Technology. 142, p. 2971-2989 19 p.Research output: Journal article publication › Journal article › Academic research › peer-review
Open Access1 Link opens in a new tab Citation (Scopus) -
An innovative multi-energy field-assisted ultra-precision machining technology: in-situ laser-magnetic dual-field assisted diamond cutting
Xing, Y., Liu, Y., Liu, C., Li, Y., Yin, T., Yin, S., Sun, Z., Zhu, Z., Xue, C., Yip, W. S. (Corresponding Author) & To, S. (Corresponding Author), 1 Apr 2026, In: International Journal of Extreme Manufacturing. 8, 2, 32 p., 025103.Research output: Journal article publication › Journal article › Academic research › peer-review
Open Access6 Link opens in a new tab Citations (Scopus) -
Comprehensive investigation of lubrication for sustainable grinding by principal component analysis (PCA) and an improved unsupervised algorithm
Yan, E. H., Guo, F., Zhou, H. T., Yip, W. S. (Corresponding Author) & To, S. (Corresponding Author), Apr 2026, In: Advanced Engineering Informatics. 71, C, 23 p., 104406.Research output: Journal article publication › Journal article › Academic research › peer-review
Open Access3 Link opens in a new tab Citations (Scopus) -
Correction: Effects of Coating Parameters of Hot Filament Chemical Vapour Deposition on Tool Wear in Micro-Drilling of High-Frequency Printed Circuit Board (Processes, (2022), 10, 8, (1466)
Kwok, F. M., Sun, Z., Yip, W. S., Kwok, K. Y. D. & To, S., May 2026, In: Processes. 14, 9, 1389.Research output: Journal article publication › Comment/debate/erratum
Open Access -
Exploring the multidimensional effects of magnetic field in magnetic-ultrasonic dual-field assisted diamond cutting: From macroscopic surface accuracy to microscopic structural evolution
Xing, Y., Li, Y., Xue, C., Yip, W. S. & To, S. (Corresponding Author), May 2026, In: Journal of Materials Processing Technology. 351, 24 p., 119297.Research output: Journal article publication › Journal article › Academic research › peer-review
1 Link opens in a new tab Citation (Scopus)
Prizes
-
49th International Exhibition of Inventions Geneva - Silver medal
To, S. (Recipient), Sun, Z. (Recipient), Yip, W. S. (Recipient), Du, X. (Recipient), Wang, S. (Recipient) & Xu, S. (Recipient), 19 Apr 2024
Prize: Prize (research)
File -
Best Paper award of ICPR-APR 2025
Lee, K. M. (Recipient), Zhu, T. (Recipient), To, S. (Recipient) & Yip, W. S. (Recipient), 19 Jun 2025
Prize: Prize (research)
File -
First Prize, 2024 China College Students Mechanical Engineering Innovation and Creativity Competition - Intelligent Precision Assembly Competition (Guangdong-Hong Kong-Macao Area Trial)
Fan, L. L. (Recipient), Xu, G. (Recipient), Zhang, B. (Recipient), Chen, L. (Recipient), Guo, F. (Recipient), To, S. (Supervisor), Xu, Z. (Supervisor) & Yip, W. S. (Supervisor), 17 Aug 2024
Prize: Prize (research)
File -
First Prize, 2024 China College Students Mechanical Engineering Innovation and Creativity Competition - Intelligent Precision Assembly Competition (Guangdong-Hong Kong-Macao Area Trial)
Wei, Z. (Recipient), Wang, J. (Recipient), Sun, L. (Recipient), Li, Y. (Recipient), Chen, L. L. (Recipient), To, S. (Supervisor), Yin, T. (Supervisor) & Yip, W. S. (Supervisor), 17 Aug 2024
Prize: Prize (research)
File -
First Prize, Province final game
Yan, H. (Recipient), Tan, W. (Recipient) & Yip, W. S. (Supervisor), May 2024
Prize: Prize (research)
File